Datacon 2200 apm manual

DATACON / BESI 22vintage. ID # Die bonder Modular machine concept Rigid cast aluminum construction Dynamic XYZ theta servo motors Datacon pattern recognition system with edge, grayBrand: DATACON / BESI. Datacon evoplus Innovative Solution for Innovative Products Future Proof Equipment s The Datacon evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization possibilities, this Missing: apm. Datacon , EVO and APM die bonders for sale. Find used die bonding equipment on www.doorway.rug: manual.

Responsible for all aspects of assembly of power amplifiers. Including running and troubleshooting all of the following die bonding (Datacon APM ), wire bonding (K+S Ball Bonder), and. This Datacon APM has been viewed times. This Datacon APM has been replied 16 times. What is this website about? EquipMatching is a global marketplace and provides a user friendly platform for people who want to sell or buy used equipment which covers a wide range of machine tools, industrial machinery, and hi-tech production. Used DATACON / BESI APM (DIE ATTACHERS) for sale. Manufacturer: DATACON / BESI Model: APM Category: DIE ATTACHERS. CAE has broad access to semiconductor related equipment direct from fabs, often unavailable through other sources. CAE finds the best deals on used DATACON / BESI APM. CAE has 20 die attachers currently available.

Datacon evo • High speed multi chip module assembly • SiP – stacked die / epoxy, spacer film and WBL (Wafer Backside Lamination) • Thin die handling (down to below 30 µm) • Reticle (multi-project) wafers • Fast product change due to recipe driven tool change • Highest performance in the high end market, up to 7, UPH. Accuracy Flexibility for your mass production. The new Datacon evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of www.doorway.ru an all new gantry controller system as well as a completely new vision and camera generation Datacon evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and. Datacon's evolving apm die bonder generation outperforms the advanced packaging systems of its competitors with its superior flexibility and extremely high precision in processing multi-chip and flip chip applications.